今天小编整理了FPC柔性线路板不良项目名词中英文对照,和大家一起分享:
| 工程类别 | 不良名称中文 | 英 文 | 
| 导线 Visual Inspection of Conductors | 导线 | Conductors | 
| 开路 | Open | |
| 短路 | Short | |
| 缺口 | Nicks | |
| 针孔 | Pinholes | |
| 额外铜刺 | Extraneous Copper Between Conductors | |
| 毛刺 | Spurs | |
| 结瘤 | Nodules | |
| 蚀刻凹痕 | Etched Concave | |
| 导线分层 | Conductor Delamination | |
| 裂纹 | Cracks | |
| 导线划痕 | Scratches on Conductor | |
| 凹坑 | Dents | |
| 变色 | Discoloration | |
| 基底薄膜 Visual Inspection of Base Film | 凹坑 | Dents | 
| 划痕 | Scratches on Base Film | |
| 覆盖层和覆盖涂层 Visual Inspection of Coverlay and Covercoat | 凹坑 | Dents on Coverlay and Covercoat | 
| 划痕 | Scratches on Coverlay and Covercoat | |
| 空洞 | Void | |
| 偏位 | Coverlay Misalign | |
| 毛刺 | Coverlay Burrs | |
| 外来物 Foreign Matters | 导电性异物 | Conductive Foreign Matters | 
| 非电性异物 | Non-conductive Foreign Matters | |
| 起泡和分层 | Blistering and Delamination | |
| 覆盖层粘结剂挤出 | Squeeze-out of Adhesive of Coverlay | |
| 覆盖涂层渗出 | Ooze-out of Covercoat | |
| 覆盖涂层跳漏 | Skipping of Convercoat | |
| 电镀金属或焊锡的表面条件 Surface Condition of Plated Mental and Solder | 镀金 | Gold Plating | 
| 镀金层缺陷 | Gold Plating Defects | |
| 镀锡 | Tin Plating | |
| 电镀金属或焊料的渗透 | Penetration of Plated Metal or Solder | |
| 变暗(变黑) | Darkened Appearance (Blackening Discoloration) | |
| 镀铜孔内镀层空洞 | Plating Voids in Plated-though Hole | |
| 镀金粗糙 | Rough Gold | |
| 镀金白雾 | Gold Discoloration | |
| 镀金变色 | Gold Discoloration | |
| 镀金层龟裂 | Gold Crack | |
| 镀金针孔 | Gold Pinhole | |
| 电镀露铜 | Plated Expose Wetting | |
| 剥离 | Plated Peeled Off | |
| 电镀渗入 | Plated Wicking | |
| 漏镀 | No Plating | |
| 表面伤痕 | Plating Scratch | |
| 电镀粗糙 | Rough Plated | |
| 药水渗入 | Wicking | |
| 外形和孔边缘 Visual Inspection of Edges of Outline and Holes | 撕裂和缺口 | Tears and Nicks | 
| 毛刺 | Burrs | |
| 丝状毛刺 | Thready Burrs | |
| 弯曲、变形 | Warpage | |
| 微连筋不良 | Poor Micro-joint | |
| 外形偏移 | Outline Misalign | |
| 外形漏冲 | No Outline | |
| 反折偏位 | Bending Line Misalign | |
| 增强板 Visual Imperfections Related to Stiffener Bonding | FPC与增强板之间的外来物 | Foreign Matter Between Flexible Printed Board and Stiffener | 
| FPC与增强板之间的空洞 | Voids Between Flexible Printed Board and Stiffener | |
| 裂纹 | Cracks | |
| 缺角 | Chip-off | |
| 划痕 | Scratches | |
| 变形 | Deformation | |
| 
 表面附着物 Affixed Substances on the Surface | 增强板贴偏移 | Stiffener Misalign | 
| 热固胶 | Thermosetting Adhesive | |
| 焊剂残渣 | Flux Residues | |
| 金属粉末残渣 | Residue of Metal Powders | |
| 粘结剂残渣 | Residue of Adhesive | |
| 突起 | Protrusions | |
| 凹坑 | Dents | |
| 弓曲 | Bow | |
| 扭曲 | Twist | |
| 标记Marking | 尺寸检验 | Dimensional Inspections | 
| 尺寸测量 | Measurement of Dimensions | |
| 外部尺寸 | External Dimensions | |
| 厚度 | Thickness | |
| 孔 | Holes | |
| 元件孔 | Component Holes | |
| 导通孔 | Via Holes | |
| 导通孔偏移 | Via Hole Misalign | |
| 安装孔 | Mounting Holes | |
| 导线宽度 | Conductor Widths | |
| 导线之间的间距 | Clearances Between Conductors | |
| 孔中心间距 | Distance Between Hole Centers | |
| 板边和导线之间的最小距离 | Minimum Distance Between Board Edges and Conductors | |
| 标记错误 | Wrong Marking | |
| 字符不清晰 | Unclear Letter | |
| 定位精度Positional Accuracy | 孔的定位精度 | Positional Accuracy of Holes | 
| 孔与焊盘的重合性 | Registration of Hole to Land | |
| 覆盖层与焊盘的重合性 | Registration of Coverlay (or Covercoat) to Land | |
| 增强板与FPC的重合性 Registration of Stiffener to FPC | 孔的重合性 | Registration of Holes | 
| 外形的重合性 | Registration of Outlines | |
| 冲外形与导线图形的重合性 | Registration of Punched Outline to Conductor Patterns | |
| 压敏胶或热固胶与FPC和增强板的重合性 | Registration of Pressure Sensitive or Heat Activated Adhesives to FPC and Stiffener | |
| 镀通孔的镀铜层厚度 | Plating Thickness of Copper Panted-through Holes | |
| 其它Other | 短装 | Shortage | 
| 混装 | Mixed Stowage/Packing | |
| 离型纸脱落 | Released Paper Peeled off | |
| 材料错误 | Wrong Material | 

 平板电脑摄像头FPC
平板电脑摄像头FPC POS机天线FPC
POS机天线FPC POS机天线FPC
POS机天线FPC 手机天线FPC
手机天线FPC