众所周知。柔性电路板具有挠曲性和可靠性，在柔性电路板厂会对成品FPC进行可靠性的测试，测试项目众多，其项目名称与英文对照如下:

  电气性能 Testing of Electrical Performance
  导线电阻 Conductor Resistance
  表面层绝缘电阻 Surface Insulation Resistance (SIR)
  表面介质层耐电压强度 Dielectric Withstanding Voltage of Surface Layers
  机械性能测试 Testing of Mechanical Property
  剥离强度 Peel Strength
  孔和焊垫的拉脱强度 Pull-out Strength for Plain Holes and Footprints
  镀层附着力 Plating Adhesion
  可焊性 Solderability
  耐挠曲性 Flexural Endurance
  耐弯折性 Bending Resistance
  环境性能 Environmental Performance
  温度循环 Temperature Cycling
  湿度测试 Humidity Test
  冷热冲击 Thermal Shock 
  镀铜通孔的耐热冲击性 Thermal Shock Resistance of Copper Plated -through Holes
  迁移性 Migration
  耐化学性 Chemical Resistance
  清洁度 Cleanliness
  阻燃性 Flame Resistance
  推力测试 Shear Test 
  手机翻盖测试 Handset Renovate Test
  窗口弯折测试 Window Bend Test
  手机滑盖测试 Sliding Test 
  焊点拉伸强度测试 Solder Point Pull Strength Test
  盐雾测试 Salt Fog Test
  蚀刻因子 Etching Factor 
  切片检测 Cross Section 
  镀层厚度 Plating Thickness
  恒温恒湿 Constant Temperature and Humidity 
  翻折疲劳测试 Fold Fatigue Test
  安定性 Dimensional Stability
  平展性 Ductility